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1. general description the pca9516a is a cmos integrated circuit intended for application in i 2 c-bus and smbus systems. while retaining all the operating modes and features of the i 2 c-bus system, it permits extension of the i 2 c-bus by buffering both the data (sdan) and the clock (scln) lines, thus enabling ?ve buses of 400 pf. the i 2 c-bus capacitance limit of 400 pf restricts the number of devices and bus length. using the pca9516a enables the system designer to divide the bus into ?ve segments off of a hub where any segment-to-segment transition sees only one repeater delay. it can also be used to run different buses at 5 v and 3.3 v or 400 khz and 100 khz buses where the 100 khz bus is isolated when 400 khz operation of the other bus is required. two or more pca9516a s cannot be put in series. the pca9516a design does not allow this con?guration. since there is no direction pin, slightly different legal low voltage levels are used to avoid lock-up conditions between the input and the output of each repeater in the hub. a regular low applied at the input of a pca9516a will be propagated as a buffered low with a slightly higher value on all the enabled outputs. when this buffered low is applied to another pca9515a, pca9516a, or pca9518a in series, the second pca9515a, pca9516a, or pca9518a will not recognize it as a regular low and will not propagate it as a buffered low again. the pca9510a/9511a/9513a/9514a and pca9512a cannot be used in series with the pca9515a, pca9516a, or pca9518a, but can be used in series with themselves since they use shifting instead of static offsets to avoid lock-up conditions. 2. features n 5 channel, bidirectional buffer n i 2 c-bus and smbus compatible n active high individual repeater enable input n open-drain input/outputs n lock-up free operation n supports arbitration and clock stretching across the repeater n accommodates standard-mode and fast-mode i 2 c-bus devices and multiple masters n powered-off high-impedance i 2 c-bus pins n operating supply voltage range of 2.3 v to 3.6 v n 5.5 v tolerant i 2 c-bus and enable pins pca9516a 5-channel i 2 c-bus hub rev. 03 23 april 2009 product data sheet
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 2 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub n 0 hz to 400 khz clock frequency 1 n esd protection exceeds 2000 v hbm per jesd22-a114, 200 v mm per jesd22-a115, and 1000 v cdm per jesd22-c101 n latch-up testing is done to jedec standard jesd78 which exceeds 100 ma n packages offered: so16 and tssop16 3. ordering information 3.1 ordering options 1. the maximum system operating frequency may be less than 400 khz because of the delays added by the repeater. table 1. ordering information type number package name description version pca9516ad so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1 pca9516apw tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 table 2. ordering options type number topside mark temperature range pca9516ad pca9516ad t amb = - 40 c to +85 c pca9516apw pa9516a t amb = - 40 c to +85 c
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 3 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 4. block diagram a more detailed view of figure 1 buffer is shown in figure 2 . the output pull-down of each internal buffer is set for approximately 0.5 v, while the input threshold of each internal buffer is set about 0.07 v lower, when the output is internally driven low. this prevents a lock-up condition from occurring. fig 1. block diagram pca9516a 002aae616 v cc scl0 sda0 en4 scl1 sda4 sda1 scl4 en1 en3 scl2 sda3 sda2 scl3 gnd buffer buffer buffer hub logic buffer buffer buffer buffer buffer hub logic buffer buffer en2 fig 2. buffer detail 002aac531 to output in inc data enable
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 4 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 5. pinning information 5.1 pinning 5.2 pin description fig 3. pin con?guration for so16 fig 4. pin con?guration for tssop16 pca9516ad scl0 v cc sda0 en4 scl1 sda4 sda1 scl4 en1 en3 scl2 sda3 sda2 scl3 gnd en2 002aae614 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 scl0 sda0 scl1 sda1 en1 scl2 sda2 gnd pca9516apw 002aae615 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 v cc en4 sda4 scl4 en3 sda3 scl3 en2 table 3. pin description symbol pin description scl0 1 serial clock bus 0 sda0 2 serial data bus 0 scl1 3 serial clock bus 1 sda1 4 serial data bus 1 en1 5 active high bus 1 enable input scl2 6 serial clock bus 2 sda2 7 serial data bus 2 gnd 8 supply ground en2 9 active high bus 2 enable input scl3 10 serial clock bus 3 sda3 11 serial data bus 3 en3 12 active high bus 3 enable input scl4 13 serial clock bus 4 sda4 14 serial data bus 4 en4 15 active high bus 4 enable input v cc 16 supply power
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 5 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 6. functional description the pca9516a is a ?ve-way hub repeater, which enables i 2 c-bus and similar bus systems to be expanded with only one repeater delay and no functional degradation of system performance. the pca9516a contains ?ve bidirectional, open-drain buffers speci?cally designed to support the standard low-level-contention arbitration of the i 2 c-bus. except during arbitration or clock stretching, the pca9516a acts like ?ve pairs of non-inverting, open-drain buffers, one for sda and one for scl. refer to figure 1 bloc k diag r am . 6.1 enable the enable pins en1 through en4 are active high and have internal pull-up resistors. each enable pin enn controls its associated sdan and scln ports. when low, the enn pin blocks the inputs from sdan and scln as well as disabling the output drivers on the sdan and scln pins. the enable pins should only change state when both the global bus and the local port are in an idle state to prevent system failures. the active high enable pins allow the use of open-drain drivers which can be wire-ored to create a distributed enable where either centralized control signal (master) or spoke signal (submaster) can enable the channel when it is idle. 6.2 i 2 c-bus systems as with the standard i 2 c-bus system, pull-up resistors are required to provide the logic high levels on the buffered bus. (standard open-collector con?guration of the i 2 c-bus.) the size of these pull-up resistors depends on the system, but each side of the repeater must have a pull-up resistor. this part is designed to work with standard-mode and fast-mode i 2 c-bus devices in addition to smbus devices. standard-mode i 2 c-bus devices only specify 3 ma output drive; this limits the termination current to 3 ma in a generic i 2 c-bus system where standard-mode devices and multiple masters are possible. please see application note an255, i 2 c/smbus repeaters, hubs and expanders for additional information on sizing resistors and precautions when using more than one pca9515a/pca9516a in a system or using the pca9515a/pca9516a in conjunction with the p82b96. 7. application design-in information a typical application is shown in figure 5 . in this example, the system master is running on a 3.3 v i 2 c-bus while the slave is connected to a 5 v bus. all buses run at 100 khz unless slave 3 is isolated, and then the master bus and slave 1 and slave 2 can run at 400 khz. any segment of the hub can talk to any other segment of the hub. bus masters and slaves can be located on all ?ve segments with 400 pf load allowed on each segment. unused ports should be isolated by holding the enable pin (enn) to gnd and/or pulling sdan/scln pins to v cc through appropriately sized resistors. the primary bus master is normally connected to sda0/scl0. if the sda0/scl0 port is not used, the pins need to be pulled to v cc through appropriately sized resistors.
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 6 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub the pca9516a is 5.5 v tolerant so it does not require any additional circuitry to translate between the different bus voltages. when one side of the pca9516a is pulled low by a device on the i 2 c-bus, a cmos hysteresis type input detects the falling edge and causes an internal driver on the other side to turn on, thus causing the other side to also go low. the side driven low by the pca9516a will typically be at v ol = 0.5 v. in order to illustrate what would be seen in a typical application, refer to figure 6 and figure 7 . if the bus master in figure 5 were to write to the slave through the pca9516a, we would see the waveform shown in figure 6 on bus 0. this looks like a normal i 2 c-bus transmission until the falling edge of the 8 th clock pulse. at that point, the master releases the data line (sda) while the slave pulls it low through the pca9516a. because the v ol of the pca9516a is typically around 0.5 v, a step in the sda will be seen. after the master has transmitted the 9 th clock pulse, the slave releases the data line. on the bus 1 side of the pca9516a, the clock and data lines would have a positive offset from ground equal to the v ol of the pca9516a. after the 8 th clock pulse, the data line will be pulled to the v ol of the slave device that is very close to ground in our example. it is important to note that any arbitration or clock stretching events on bus 1 require that the v ol of the devices on bus 1 be 70 mv below the v ol of the pca9516a (see v ol - v ilc in section 9 static char acter istics ) to be recognized by the pca9516a and then transmitted to bus 0. fig 5. typical application 002aae617 scl1 sda1 slave 1 sda scl 400 khz 5 v scl2 sda2 slave 2 sda scl 400 khz 3.3 v scl3 sda3 slave 3 sda scl 100 khz 5 v scl4 sda4 3.3 v or 5 v pca9516a v cc scl0 sda0 scl 3.3 v sda en2 en1 en3 en4 bus master 400 khz
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 7 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 8. limiting values fig 6. bus 0 waveform 9 th clock pulse v ol of master v ol of pca9516a 002aae618 scl sda fig 7. bus 1 waveform 9 th clock pulse v ol of slave v ol of pca9516a 002aae619 scl sda table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages with respect to gnd. symbol parameter conditions min max unit v cc supply voltage - 0.5 +7 v v bus voltage range i 2 c-bus scln or sdan - 0.5 +7 v i dc current any pin - 50 ma p tot total power dissipation - 300 mw t stg storage temperature - 55 +125 c t amb ambient temperature operating - 40 +85 c
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 8 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 9. static characteristics [1] for operation between published voltage ranges, refer to worst case parameter in both ranges. [2] typical value taken at 3.3 v and 25 c. [3] v il speci?cation is for the ?rst low level seen by the sdan/scln lines. v ilc is for the second and subsequent low levels seen by the sdan/scln lines. table 5. static characteristics (v cc = 3.0 v to 3.6 v) v cc = 3.0 v to 3.6 v [1] ; gnd = 0 v; t amb = - 40 c to +85 c; unless otherwise speci?ed. symbol parameter conditions min typ [2] max unit supplies v cc supply voltage 3.0 - 3.6 v i cch high-level supply current both channels high; v cc = 3.6 v; sdan = scln = v cc - 2.1 5 ma i ccl low-level supply current both channels low; v cc = 3.6 v; one sdan and one scln = gnd, other sdan and scln open - 4.7 10 ma i cclc contention low-level supply current v cc = 3.6 v; sdan = scln = gnd - 4.0 10 ma input scln; input/output sdan v ih high-level input voltage 0.7v cc - 5.5 v v il low-level input voltage [3] - 0.5 - +0.3v cc v v ilc contention low-level input voltage [3] - 0.5 - +0.4 v v ik input clamping voltage i i = - 18 ma - - - 1.2 v i li input leakage current v i = 3.6 v - 1- +1 m a i il low-level input current sdan, scln; v i = 0.2 v - - 5 m a v ol low-level output voltage i ol = 0 ma or 6 ma 0.47 0.52 0.6 v v ol - v ilc difference between low-level output and low-level input voltage contention guaranteed by design - - 70 mv c i input capacitance v i = 3 v or 0 v - 6 10 pf enable inputs en1 to en4 v il low-level input voltage - 0.5 - +0.8 v v ih high-level input voltage 2.0 - 5.5 v i il low-level input current en1 to en4; v i = 0.2 v - - 12 - 30 m a i li input leakage current - 1- +1 m a c i input capacitance v i = 3 v or 0 v - 6 7 pf
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 9 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub [1] for operation between published voltage ranges, refer to worst case parameter in both ranges. [2] typical value taken at 2.5 v and 25 c. [3] v il speci?cation is for the ?rst low level seen by the sdan/scln lines. v ilc is for the second and subsequent low levels seen by the sdan/scln lines. table 6. static characteristics (v cc = 2.3 v to 2.7 v) v cc = 2.3 v to 2.7 v [1] ; gnd = 0 v; t amb = - 40 c to +85 c; unless otherwise speci?ed. symbol parameter conditions min typ [2] max unit supplies v cc supply voltage 2.3 - 2.7 v i cch high-level supply current both channels high; v cc = 2.7 v; sdan = scln = v cc - 2.1 5 ma i ccl low-level supply current both channels low; v cc = 2.7 v; one sdan and one scln = gnd, other sdan and scln open - 4.6 10 ma i cclc contention low-level supply current v cc = 2.7 v; sdan = scln = gnd - 3.9 10 ma input scln; input/output sdan v ih high-level input voltage 0.7v cc - 5.5 v v il low-level input voltage [3] - 0.5 - +0.3v cc v v ilc contention low-level input voltage [3] - 0.5 - +0.4 v v ik input clamping voltage i i = - 18 ma - - - 1.2 v i li input leakage current v i = 2.7 v - 1- +1 m a i il low-level input current sdan, scln; v i = 0.2 v - - 5 m a v ol low-level output voltage i ol = 0 ma or 6 ma 0.47 0.52 0.6 v v ol - v ilc difference between low-level output and low-level input voltage contention guaranteed by design - - 70 mv c i input capacitance v i = 3 v or 0 v - 6 10 pf enable inputs en1 to en4 v il low-level input voltage - 0.5 - +0.8 v v ih high-level input voltage 1.5 - 5.5 v i il low-level input current en1 to en4; v i = 0.2 v - - 10 - 30 m a i li input leakage current - 1- +1 m a c i input capacitance v i = 3 v or 0 v - 6 7 pf
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 10 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 10. dynamic characteristics [1] typical value taken at 2.5 v and 25 c. [2] different load resistance and capacitance will alter the rc time constant, thereby changing the propagation delay and transi tion times. [1] typical value taken at 3.3 v and 25 c. [2] different load resistance and capacitance will alter the rc time constant, thereby changing the propagation delay and transi tion times. table 7. dynamic characteristics (v cc = 2.3 v to 2.7 v) v cc =2.3v to 2.7v; gnd=0v; t amb = - 40 c to +85 c; unless otherwise speci?ed. symbol parameter conditions min typ [1] max unit t phl high to low propagation delay figure 8 45 93 150 ns t plh low to high propagation delay figure 8 [2] 33 90 135 ns t thl high to low output transition time figure 8 -60-ns t tlh low to high output transition time figure 8 [2] - 131 - ns t su set-up time enn to start condition 100 - - ns t h hold time enn after stop condition 130 - - ns table 8. dynamic characteristics (v cc = 3.0 v to 3.6 v) v cc =3.0v to 3.6v; gnd=0v; t amb = - 40 c to +85 c; unless otherwise speci?ed. symbol parameter conditions min typ [1] max unit t phl high to low propagation delay figure 8 45 75 120 ns t plh low to high propagation delay figure 8 [2] 33 60 83 ns t thl high to low output transition time figure 8 -47-ns t tlh low to high output transition time figure 8 [2] - 130 - ns t su set-up time enn to start condition 100 - - ns t h hold time enn after stop condition 100 - - ns fig 8. propagation delay and transition times 002aad478 3.3 v 3.3 v t plh t thl 1.5 v 1.5 v input output 20 % 1.5 v 1.5 v 80 % 20 % 80 % t phl t tlh v ol 0.1 v
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 11 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 11. test information r l = load resistor; 1.35 k w . c l = load capacitance includes jig and probe capacitance; 50 pf. r t = termination resistance should be equal to z o of pulse generators. fig 9. test circuit for open-drain outputs pulse generator v o c l r l 002aad479 r t v i v cc v cc dut
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 12 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 12. package outline fig 10. package outline sot109-1 (so16) x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 13 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub fig 11. package outline sot403-1 (tssop16) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot403-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 18 16 9 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 a max. 1.1 pin 1 index
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 14 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 13. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 surface mount re?ow soldering description . 13.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electrical circuits. the soldered joint provides both the mechanical and the electrical connection. there is no single soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for ?ne pitch smds. re?ow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 wave and re?ow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. the re?ow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both wave and re?ow soldering are: ? board speci?cations, including the board ?nish, solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivity level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 13.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhesive and ?ux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath speci?cations, including temperature and impurities
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 15 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 13.4 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; note that a lead-free re?ow process usually leads to higher minimum peak temperatures (see figure 12 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in accordance with t ab le 9 and 10 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during re?ow soldering, see figure 12 . table 9. snpb eutectic process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 3 350 < 2.5 235 220 3 2.5 220 220 table 10. lead-free process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 16 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub for further information on temperature pro?les, refer to application note an10365 surface mount re?ow soldering description . 14. abbreviations msl: moisture sensitivity level fig 12. temperature pro?les for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 11. abbreviations acronym description cdm charged-device model cmos complementary metal-oxide semiconductor dut device under test esd electrostatic discharge hbm human body model i 2 c-bus inter-integrated circuit bus mm machine model rc resistor-capacitor network smbus system management bus
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 17 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 15. revision history table 12. revision history document id release date data sheet status change notice supersedes pca9516a_3 20090423 product data sheet - pca9516a_2 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? section 1 gener al descr iption , 5 th paragraph: referenced part type numbers changed from pca951x to pca951xa ? added soldering information ? added section 14 ab bre viations pca9516a_2 (9397 750 14108) 20040929 product data sheet - pca9516a_1 pca9516a_1 (9397 750 13238) 20040528 product data sheet - -
pca9516a_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 23 april 2009 18 of 19 nxp semiconductors pca9516a 5-channel i 2 c-bus hub 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. i 2 c-bus logo is a trademark of nxp b.v. 17. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors pca9516a 5-channel i 2 c-bus hub ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 23 april 2009 document identifier: pca9516a_3 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 3.1 ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 functional description . . . . . . . . . . . . . . . . . . . 5 6.1 enable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 i 2 c-bus systems . . . . . . . . . . . . . . . . . . . . . . . . 5 7 application design-in information . . . . . . . . . . 5 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 8 10 dynamic characteristics . . . . . . . . . . . . . . . . . 10 11 test information . . . . . . . . . . . . . . . . . . . . . . . . 11 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 13 soldering of smd packages . . . . . . . . . . . . . . 14 13.1 introduction to soldering . . . . . . . . . . . . . . . . . 14 13.2 wave and re?ow soldering . . . . . . . . . . . . . . . 14 13.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14 13.4 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 15 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 18 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 17 contact information. . . . . . . . . . . . . . . . . . . . . 18 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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